Hoffmann + Krippner supplies trade fair models for HP at Formnext

Formnext, the world’s largest additive manufacturing event with 600+ exhibitors, offers everything there is to know about the future of manufacturing technologies. This year, despite Corona measures, the show was again a great success.

At the HP 3D Printing booth, we showcased 3D printed models for electronics enclosures, IoT sensors, e-scooter charging stations, and IP-rated mobile and weatherproof outdoor devices.

We developed and produced all applications using the multi-jet fusion (MJF) process for the industrial sector. On the basis of our exhibition models we will show you the manifold technical possibilities of this printing process.

If you have any questions, please do not hesitate to contact Jens Arend, Jens Schnur and Andreas Bayer (j.arend@hk.systems / j.schnur@hk.systems / a.bayer@hk.systems).

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